Fukue gave a presentation entitled “Thermal management – challenges for components, circuit design and related measurement and simulation techniques” at IEC / TC40 Technology Session 2024. Thank you very much for all participant’s kind attention.
Japan’s thermal design engineers and researchers team, including JEITA thermal management standardization Gr., develop these new methodologies for improving the thermal management of next-generation surface-mounted components. We would appreciate it if you could support our activities.