Fukada-Kun, Fukuda-Kun, and Fukue gave each presentation at ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021.
(Titles and authors)
- Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
(Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka) - CFD – Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
(Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi) - Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
(Takashi Fukue, Koichi Hirasawa)
Conference website is as follows;
https://event.asme.org/InterPACK
